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Job Title: Team Lead – Hardware Design Engineer (RF, Power Supply & High-Speed SOM)

Location: [Bangalore / Onsite]

Department: Hardware Design / Product Engineering

Job Summary:

We are seeking an experienced Team Lead – Hardware Design Engineer to lead the design, development, and validation of RF, power supply, and high-speed SOM-based electronic hardware for IoT and communication products.

The ideal candidate will have hands-on expertise in RF circuit design, mixed-signal board design, high-speed SOM integration, and power management systems, along with strong leadership and project management skills.

You will drive hardware architecture decisions, guide design engineers, and collaborate closely with firmware, mechanical, and manufacturing teams to deliver high-quality, production-ready hardware designs.

Key Responsibilities:

1. Hardware Architecture & Design Leadership

• Lead the end-to-end design and development of embedded hardware systems, including RF, analog, digital, and power circuits.
• Define hardware architecture, component selection, and schematic design for SOM-based systems (e.g., i.MX, Sitara, STM32MP, or similar).
• Review and guide PCB layout design with emphasis on signal integrity, EMI/EMC, thermal, and mechanical constraints.
• Architect RF front-end designs (sub-GHz / 2.4 GHz) including PA/LNA matching, filters, and antennas.
• Design and validate DC-DC converters, LDOs, and power sequencing circuits for embedded and RF systems.
• Product reliability, HALT and environmental testing to design robust products

2. Technical Oversight & Team Management

• Mentor and manage a team of hardware design engineers and layout designers.
• Assign tasks, review design outputs, and ensure adherence to project timelines and design standards.
• Conduct design and peer reviews, ensuring reliability, manufacturability, and compliance with standards.
• Collaborate with firmware, mechanical, and test teams for system integration and bring-up.

3. Testing & Validation

• Oversee hardware validation, including power, signal integrity, and RF performance testing.
• Work with lab equipment (oscilloscopes, spectrum analyzers, VNAs, signal generators) for validation and debugging.
• Drive design optimization for performance, power efficiency, and cost.
• Support EMI/EMC testing, pre-certification, and compliance processes (CE, FCC, BIS, etc.).

4. Production & Lifecycle Support

• Work with manufacturing teams for DFM/DFT and prototype-to-production transition.
• Support root-cause analysis and field issue resolution for deployed hardware.
• Maintain detailed documentation of schematics, BOMs, test reports, and design revisions.

Qualifications & Skills:

• Bachelor’s / Master’s degree in Electronics, Electrical, or Communication Engineering.
• 8–12 years of experience in hardware design, with at least 2–3 years in a team leadership role.
• Strong technical expertise in:
• RF design (sub-GHz, 2.4 GHz, impedance matching, antenna tuning, PA/LNA integration).
• Power electronics (DC-DC converters, LDOs, PMICs, protection circuits).
• High-speed board design (DDR, USB, Ethernet, MIPI, PCIe).
• SOM-based system integration (NXP, TI, or similar modules).
• Proficiency in schematic and layout tools (Altium Designer, Cadence Allegro, or OrCAD).
• Delivered 3-4 product designs from proto to mass manufacturing
• Experience in signal integrity and simulation tools (HyperLynx, ADS, ANSYS, etc.).
• Familiarity with testing instruments and hands-on experience in hardware bring-up and debugging.
• Strong understanding of DFM/DFT, EMI/EMC design practices, and regulatory compliance.
• Excellent communication, leadership, and cross-functional collaboration skills.

Preferred Attributes:

• Experience in IoT, Smart Metering, or Communication Product hardware.
• Exposure to Wi-SUN, LoRa, BLE, or Cellular RF front-end design.
• Experience with low-power and battery-based system design.
• Knowledge of reliability testing, environmental validation, and hardware qualification.
• Prior experience working in startup or agile product development environments.

Why Join Us:

• Lead hardware innovation for next-generation IoT and communication platforms.
• Opportunity to own complete hardware development cycles — from concept to field deployment.
• Collaborative, fast-paced engineering environment that values creativity and technical excellence.
• Growth path to Hardware Architect / Head of Hardware Engineering roles.

• Experience in 3DCS(preferred) Stack up tool or any other 3D Tolerance analysis tool
• Experience in performing Tolerance stack up calculations (1D & 2D) like Worst case, RSS etc
• Experience in using GD&T symbols in drawing (ASME or ISO)
• Knowledge in Parts & Assembly inspection technics (CMM, Inline Measurement etc.)
• Knowledge in Assembly technics (Basic understanding of jig and fixture concept)
• Knowledge in Press, Injection moulding & Casting tools.
• Exposure to Component / Overall vehicle development process
• Fair communication and interpersonal skills.