10+ RF optimization Jobs in India

Interested in designing award-winning wearables while managing challenging constraints so that your products are used everyday by millions of users? Then read on..

ULTRAHUMAN • HARDWARE

Hardware Design Engineer Wearables

Bangalore (Kudlu Gate)| • On-site | Full-time |

ABOUT THE ROLE

Ultrahuman's Hardware division builds award-winning wearables the Ultrahuman Ring and Ring Air pushing consumer technology in health and metabolic fitness. We're looking for a Hardware Design Engineer to own electronics design for our next-generation smart rings, from architecture and schematic capture through PCB layout, bring-up, and mass production.

This is a hands-on role at the extremes of miniaturization and power efficiency. You'll make architecture-level component decisions, drive high-density and RF layout, and take designs through NPI to volume — working closely with mechanical, firmware, and manufacturing teams on fast product cycles.

KEY RESPONSIBILITIES

Architecture & Schematic Design

• Translate product requirements into hardware architecture, then into schematics and manufacturable PCB designs using OrCAD / Allegro (Cadence).
• Own component selection across MCU/SoC, PMIC, sensor AFEs, and RF front-ends — balancing size, power, cost, and supply availability.
• Handle schematic-to-layout conversion and netlist import; create and maintain symbol/footprint libraries and land patterns.

High-Density & RF Layout

• Design and review high-density (HDI), rigid, and rigid-flex PCB layouts for space-constrained wearable form factors.
• Design 2.4 GHz BLE antennas and NFC coils, matching networks, and controlled-impedance routing; support antenna tuning and RF validation.
• Apply signal-integrity best practices for high-speed digital interfaces and mixed-signal boards.

Power & Low-Power Design

• Architect power trees around PMICs, buck/boost converters, and LDOs, including Li-ion charging for small-capacity cells.
• Build and validate ultra-low-power current budgets to meet multi-day battery-life targets.
• Strong grasp of power electronics and active/passive component behaviour.

Sensor Integration

• Integrate optical biosensing (PPG) AFEs, IMUs, temperature sensors, and haptics; own I²C/SPI interface design and analog front-end layout.

Manufacturing & DFM

• Own Gerber/ODB++ release, fabrication and assembly drawings, panelization, and full manufacturing data packages.
• Prepare and maintain BOMs; evaluate and qualify alternate / second-source components.
• Drive DFM/DFA reviews with fab and SMT/EMS partners; support NPI through EVT/DVT/PVT to mass production.
• Sound understanding of PCB materials, stackups, and component assembly processes.

Compliance, Reliability & Validation

• Apply EMI/EMC, thermal, and mechanical design best practices.
• Support pre-compliance and certification across FCC, CE, BIS, and RoHS, and familiarity with IEC standards for PCB design safety.
• Coordinate with test engineers on board bring-up and PCB validation; run circuit simulations for RF and signal/timing optimization.

Ownership & Collaboration

• Independently manage hardware projects end-to-end, including vendor coordination and delivery of final hardware.
• Collaborate with mechanical engineers to optimize designs and meet project timelines.
• Bring the latest design tools, methodologies, and industry best practices into the team.

REQUIRED QUALIFICATIONS

• Bachelor's or Master's in EEE, Electronics, or equivalent practical experience.
• 4+ years of hands-on hardware / PCB design experience, ideally in consumer electronics or wearables.
• Proficiency with a leading schematic and PCB toolchain (OrCAD / Allegro preferred).
• Proven track record taking a product from schematic through layout to volume production.
• Working knowledge of power electronics and active/passive component selection.
• Familiarity with global certifications (FCC, CE, BIS, RoHS) and IEC PCB safety standards.

PREFERRED / BONUS

• Experience with miniaturized high-density or rigid-flex designs.
• RF design experience (2.4 GHz / BLE, NFC, antenna tuning and matching).
• EMI/EMC design and pre-compliance testing experience.
• Low-power / battery-operated wearable product experience.
• Familiarity with reliability methods (DFMEA, derating) and RF / signal-timing circuit simulation.

Job Title: Embedded Firmware Engineer (RF Focus)

Location: Gurgaon, Haryana (On -site)

Employment Type: Full-Time

Experience: 3-5 years

We’re hiring an Embedded Firmware Engineer (3–5 yrs) with strong experience in Sub-GHz RF, LoRa/LoRaWAN, and IoT systems. The role focuses on firmware development, RF communication, and secure telemetry.

About Aaizel Tech

Aaizel Tech is a pioneering tech startup at the intersection of cybersecurity, AI, geospatial solutions, and more. We drive innovation by delivering transformative technology solutions across industries. As part of our dynamic team, you'll gain hands-on experience and learn from experts who are dedicated to pushing the boundaries of what's possible.

Responsibilities

• Develop firmware for STM32 (WL/H/L/F series)

• Design & implement Sub-GHz RF (403/433/868/915 MHz) systems

• Work on LoRa PHY/MAC & LoRaWAN stack (OTAA/ABP, uplink/downlink)

• Perform RF testing & debugging (RSSI, SNR, range testing, SDR/spectrum tools)

• Implement secure communication (AES-128/256, CRC/SHA)

• Develop drivers: UART, SPI, I2C, ADC, DMA

• Work with FreeRTOS (tasks, queues, ISRs, low power)

• Build communication stacks: RS485/Modbus, RS232, MQTT, TCP/IP, UDP

• Implement bootloader & OTA updates

• Debug using SWD/JTAG, logic analyzer, DSO

• Optimize for performance, power, and RF reliability

Requirements

• 3–5 years in embedded firmware + RF systems

• Strong in Embedded C, STM32CubeIDE, HAL/LL

• Hands-on with LoRa/LoRaWAN & Sub-GHz communication

• Understanding of RF fundamentals (link budget, interference, antennas)

• Experience in secure communication (AES)

• Good knowledge of FreeRTOS & industrial protocols (RS485/Modbus)

• Strong debugging skills (firmware + RF)

• Basic hardware/RF PCB understanding

Good to Have

• Experience with ChirpStack / TTN

• Knowledge of FSK/GFSK

• RF certification exposure (CE/FCC/ETSI)

How to Apply

• Please submit your resume, portfolio, and a cover letter outlining your relevant experience and how you can contribute to Aaizel Tech’s success.

MANDATORY CRITERIA:

• Education: B.Tech / M.Tech in ECE / CSE / IT
• Experience: 10–12 years in hardware board design, system hardware engineering, and full product deployment cycles
• Proven expertise in digital, analog, and power electronic circuit analysis & design
• Strong hands-on experience designing boards with SoCs, FPGAs, CPLDs, and MPSoC architectures
• Deep understanding of signal integrity, EMI/EMC, and high-speed design considerations
• Must have successfully completed at least two hardware product development cycles from high-level design to final deployment
• Ability to independently handle schematic design, design analysis (DC drop, SI), and cross-team design reviews
• Experience in sourcing & procurement of electronic components, PCBs, and mechanical parts for embedded/IoT/industrial hardware
• Strong experience in board bring-up, debugging, issue investigation, and cross-functional triage with firmware/software teams
• Expertise in hardware validation, test planning, test execution, equipment selection, debugging, and report preparation
• Proficiency in Cadence Allegro or Altium EDA tools (mandatory)
• Experience coordinating with layout, mechanical, SI, EMC, manufacturing, and supply chain teams
• Strong understanding of manufacturing services, production pricing models, supply chain, and logistics for electronics/electromechanical components

DESCRIPTION:

COMPANY OVERVIEW:

The company is a semiconductor and embedded system design company with a focus on Embedded, Turnkey ASICs, Mixed Signal IP, Semiconductor & Product Engineering and IoT solutions catering to Aerospace & Defence, Consumer Electronics, Automotive, Medical and Networking & Telecommunications.

REQUIRED SKILLS:

• Extensive experience in hardware board designs and towards multiple product field deployment cycles.
• Strong foundation and expertise in analyzing digital, Analog and power electronic circuits.
• Proficient with SoC, FPGAs, CPLD and MPSOC architecture-based board designs.
• Knowledgeable in signal integrity, EMI/EMC concepts for digital and power electronics.
• Completed at least two project from high-level design to final product level deployment.
• Capable of independently managing product’s schematic, design analysis DC Drop, Signal Integrity, and coordinating reviews with peer of layout, mechanical, SI, and EMC teams.
• Sourcing and procurement of electronic components, PCBs, and mechanical parts for cutting-edge IoT, embedded, and industrial product development.
• Experienced in board bring-up, issue investigation, and triage in collaboration with firmware and software teams.
• Skilled in preparing hardware design documentation, validation test planning, identifying necessary test equipment, test development, execution, debugging, and report preparation.
• Effective communication and interpersonal skills for collaborative work with cross-functional teams, including post-silicon bench validation, BIOS, and driver development/QA.
• Hands-on experience with Cadence Allegro/Altium EDA tools is essential.
• Familiarity with programming and scripting languages like Python and Perl, and experience in test automation is advantageous.
• Should have excellent exposure with coordination of Manufacturing Services, pricing model for production value supply chain & Logistics in electronics and electromechanical components domain.

Key Responsibilities:

1.    Development, integration and testing of embedded software in the Embedded Linux RTOS

2.    Integrate Application based on Adaptive AUTOSAR Platform

3.    Contribute for Architecture, Detailed design, programming in C++ (11/14/17)

4.    Perform Unit, Integration Tests of developed Application

5.    Detail oriented systematic problem-solving approach in the embedded software.

6.    Debug embedded software on hardware platforms for issue identification and resolution

Minimum qualification criteria:

1.    Bachelor's degree in Electronics, Computer Science, Electrical Engineering, or related field

2.    2+ years of experience in software development in C or C++

3.    2+ years of experience in designing and implementing embedded systems for high performance, high reliability real-time embedded computing platforms

RF Engineer Job Responsibilities:

• Ensuring RF test equipment is calibrated to industry standards.
• Testing the performance of existing wireless products.
• Analysing RF broadcasting product and suggesting improvements.
• Troubleshooting RF tuning / antenna circuit issues.
• RF antenna design (PCB Antenna Design).
• Conducting laboratory tests on RF products.
• Ensuring regulatory standards are met.

RF Engineer Requirements:

• Bachelor's degree in Electronics engineering or a similar field.
• At least 5 years of experience as an RF engineer in the RF industry.
• Advanced knowledge of LTE and RF (Bluetooth/Wireless) networks.
• Excellent written and verbal communication skills.
• Knowledge of RF hardware systems and testing equipment.

• Technical Experience on Physical Layer of 3GPP LTE
• Experience on DSP Development\
• Proficient in C Good
• understanding of Wireless Communications
• Experience on MAC-PHY interface
• Behavioral Interpersonal skills & Ability to work in team
• Good Communication Skills Good Analytical Skills

• Technical Experience on Physical Layer of 3GPP LTE Experience on DSP Development\
• Proficient in C
• Good understanding of Wireless Communications
• Experience on MAC-PHY interface
• Behavioral Interpersonal skills & Ability to work in team
• Good Communication Skills Good Analytical Skills
• Customer Orientation Job Title LTE Developer with DSP Physical Layer(Engineer/Senior Engineer)